Recognized as one of the leading Independent Distributors in the mitigation and fight against counterfeit components, NSC internal processes were developed to reduce Customer risk. All of our Quality Control Personnel have been trained or certified to meet the requirements of IDEA-ICE-3000 and CTI CCAP-101.  In addition, all NSC Employees have attended various counterfeit avoidance workshops, furthering our arsenal of knowledge and laying the foundation to win the fight.

NSC offers counterfeit detection, testing and services, as well as a full array of value added services:

• Counterfeit Detection and Avoidance Processes:
  • Verification of material counterfeit issues via industry sources during sourcing
  • Verification and approval of Vendors before material purchase
  • Verification of received material outer packaging upon receipt
  • Verification of Vendor supplied documentation upon receipt
  • Verification of received material inner packaging upon receipt
  • Verification of material part markings and identification upon receipt
  • Verification of material marking permanency & coating tests upon receipt
  • Verification of material package and lead evaluation upon receipt
  • Verification of material internal package and layout upon receipt
• In House Testing and Value Added Services:
  • CTI CCAP-101 Certification Levels A and B
  • Component and Material Baking
  • Decapsulation Verification
  • Dry Packaging with available Nitrogen Purge
  • Heated Solvency Tests
  • Parametric Testing (Curve Tracer)
  • Robotic Lead Tinning
  • Scanning Acoustic Microscopy
  • Solderability Testing
  • Tape and Reeling
  • X-Ray Verification
  • XRF/RoHS Verification

CTI Counterfeit Component Avoidance Program

• The Counterfeit Components Avoidance Program (CCAP 101) was developed by Components Technology Institute Inc. to meet the objectives of AS5553 to detect and avoid counterfeit electronic components purchased from Independent Distributors and Brokers for aerospace applications in a technical and cost effective manner.
• The requirements apply to new components, never installed (Used) on circuit boards, which are authentic to markings for both military and commercial Customers.
• The CCAP-101 requirements apply to all discrete semiconductors, integrated circuits, hybrid microcircuits and passive components, which are sold as certified per CCAP-101
• This certification program provides for a choice of Level A (which includes electrical testing) or Level B (which excludes electrical testing) specified by the customer.
• The Mandatory Elements of the Certification Program to CCAP-101 are noted below:
  • CTI review and approval of ID inspection procedures
  • CTI audit of ID avoidance practices
  • Mandatory purchasing practices by ID
  • Documentation inspection
  • Product inspection, sampling and testing of markings
  • X-Ray inspection
  • XRF of leads
  • De-capping inspection
  • Electrical Testing - DC, functional and product specific tests, level A only
  • Selection and control of outside test labs
  • Counterfeit Avoidance Inspection Report
  • E-Documentation retention of data specifically required
  • Supply of inspection results summary and Level A or B Certificate to the customer with delivery of the parts
• Click to view NSC's CCAP-101

Component and Material Baking

NSC uses the Lindberg Model Blue M 300 Mechanical Convection Oven for dry baking components. The oven features internal blowers which circulate heated air throughout the chamber for maximum temperature uniformity. The temperature range of the oven is +40°C to +300°C, ±1% at +100°C and meets the requirements of J-STD-033.

Lindberg Model Blue M 300 Mech. Convection Oven	Materials After Dry Bake and Before Sealing
	Final Packaging After Dry Bake and Sealing

Decapsulation Verification

North Shore Components offers in house decapsulation verification, which is utilized in conjunction with high-powered microscopes to verify and authenticate OEM devices. Testing is performed to verify the inner die markings and working of the unit under test utilizing the Nisene Technology Group Model 350 D2I Plastic Decapsulator. More »

		Component Die Showing Wire Bonds	Manufacturer Die Layout
		Internal Die Markings	Component Die Layout

Dry Packing with Nitrogen Purge

North Shore Components performs in house dry packing with nitrogen purge to protect moisture sensitive materials and ensure material life for long term storage, utilizing the SECO/Gramatech Model MVP-18 Mighty Mutt Vacuum Sealer. More »

Heated Solvency Tests

North Shore Components performs in house Heated Solvency Test to check for the resurfacing of components with epoxy coatings.

Parametric Testing (Curve Tracer)

NSC performs parametric testing using the SONY Tektronix 370 Programmable Curve Tracer; which performs DC parametric characterization of transistors, thyristors, diodes, SCRs, MOSFETs, opto-electronic components, solar cells, solid-state displays, and other semiconductor devices IAW Mfg. specifications. More »

Tektronix Model 370 Programmable Curve Tracer	Mfg Data Sheet Used To Perform Paraetric Testing

Robotic Lead Tinning (Hot Solder Dip)

NSC performs in house lead tinning services to ensure component terminations properly wet to the PCB.  This process was developed IAW GEIA-STD-0006: Requirements for Using Hot Solder Dip to Replace the Finish on Electronic Components using the KISS-LTS200 Robotic Lead Tinning System. More »

KISS-LTS200 Robotic Lead Tinning System	Component Showing Poor Solder Coverage

Scanning Acoustic Microscopy

NSC provides AM Testing for the evaluation of the interior physical properties of materials such as voids and evidence of delamination IAW Mil-STD-883 TM 2030 and/or J-STD-035, utilizing the Insight 200 Acoustic Microscope Inspection System. More »

Insight 200 Acoustic Microscope Inspection System	A-Scan and C-Scan of component showing adverse delamination

Solderability Testing

NSC provides Solderability testing, which determines the ability of the termination to form a uniform, smooth, film of solder on its surface with excellent adhesion properties IAW J-STD-002, utilizing the Metronelec Menisco ST78 Solderability Machine. More »

Metronelec Menisco ST78 Solderability Machine	Solderability Test Report

Tape and Reel

NSC provides tape and reeling services; which ensures that material can be automatically handled during the reflow process of adhering surface mounted devices to printed circuit boards IAW ANSI/EIA-481, utilizing the QMT-1100 D Manual Taping System; available reel sizes are 7” and 13”. More »

QMT-1100 D Manual Taping System	Automated Tape and Reel Machine

X-Ray Verification

NSC preforms X-ray verification in house utilizing the Glenbrook Technology Model RTX 113HV X-RAY Machine and the Creative Electron TruView 180-3HD X-Ray Inspection System.  X-Ray Testing validates consistency of component lead frames and die layouts by component comparisons and ensures inner wire bonds are intact and conforms to OCM specifications. More »

Glenbrook Technology RTX-113HV	Creative Electron TruView 180-3HD

XRF/RoHS

NSC preforms XRF/RoHS verification in house utilizing the Innov-X Systems Model Alpha 6500 XRF/RoHS Tester.  This test validates if the component terminations conforms to the Mfg. or RoHS Specifications for component finishes based on Mfg. part number ordering data. More »

Innov-X Systems Model Alpha 6500 XRF/RoHS Tester	Inconclusive RoHS Test Report