North Shore Components offers in house decapsulation equipment, which is utilized in conjunction with high-powered microscopes to verify and authenticate OEM devices. Package types tested by North Shore Components include:
- DIP devices
- Small quad flat packs (QFP)
- Large TQFPs
- Small outline devices
- Large SOIC devices
- Die down and fine pitch BGAs
- PPGA devices
- Smart cards
To conduct these tests, North Shore Components utilizes the state-of-the-art Jet Etch automated acid decapsulation system that removes outer layers that encapsulate complex, high density packages such as BGAs, multi-die BGAs, FPBGAs and chip scale packages to expose die markings, bond pads, bond wires and lead frame interconnects. These components are then examined by carefully trained and CCAP-101 certified inspectors who use high power microscopes to determine if the device is authentic or counterfeit. This system works with the following acids:
- Nitric Acid (90% yellow or white fuming or 98% fuming)
- Sulfuric Acid (96-98% fuming);
- Mixed etchants (programmable in six ratios)
The Jet Etch system is easy to operate, fully programmable, and capable of storing multiple etch programs for different package types to ensure reliable and consistent results. A high brightness six line alphanumeric display ensures excellent visibility under all conditions of fume hood illumination. For more information on decapsulation and other in house counterfeit avoidance and detection testing services available from North Shore Components, contact us today.
